Optimus MR3

Introducing the Optimus MR3, a pinnacle of technological innovation designed to redefine the standards of semiconductor assembly. Crafted for precision, efficiency, and versatility, this advanced system seamlessly integrates groundbreaking features to elevate your semiconductor manufacturing processes.

The 6S Inspection feature goes beyond industry standards, ensuring a thorough examination of components, leaving no room for imperfections in your semiconductor assemblies.The Optimus MR3 is not just a tool; it's a technological leap forward in semiconductor assembly. Embrace precision, efficiency, and adaptability with Optimus MR3 – where every assembly is a testament to excellence in semiconductor manufacturing.

Key Features

WAFER TO WAFER

The Optimus MR3 specializes in wafer-to-wafer assembly, ensuring a seamless and precise integration of semiconductor components. Experience the next level of precision in your manufacturing processes.

SUPH UP TO 15,000

Elevate your production capabilities with an impressive SUPH (Strips per Hour) capacity of up to 15,000. The Optimus MR3 ensures high-speed and uninterrupted wafer assembly, optimizing your overall manufacturing efficiency.

DIE SIZE 0.5X0.5MM TO 15X15MM

Adapt to diverse semiconductor requirements with the Optimus MR3's versatile die size compatibility. From ultra-compact 0.5x0.5mm dies to larger 15x15mm options, this system accommodates a broad spectrum of semiconductor components.

PLACEMENT ACCURACY +/- 30ΜM

Redefine precision with the Optimus MR3's exceptional placement accuracy. Achieve meticulous alignment with an accuracy of +/- 30µm, ensuring the reliability and performance of your semiconductor assemblies.

6S INSPECTION

The Optimus MR3 goes beyond standard inspections with its 6S Inspection, ensuring a comprehensive scrutiny of components. Detect imperfections, anomalies, and deviations from quality standards with unmatched thoroughness.