Unleash the future of semiconductor die sorting with the Caerus Series C350 - a groundbreaking Wafer to Tape and Reel system designed for unparalleled precision, speed, and adaptability. Elevate your semiconductor manufacturing processes with cutting-edge features seamlessly integrated into the C350, redefining the standards of die sorting.
Key Features
WAFER TO TAPE & REEL
The C350 from the Caerus Series excels in precision Wafer to Tape and Reel conversion, ensuring a seamless transition from wafer to meticulously sorted and packaged semiconductor components.
SUPH UP TO 45,000
Supercharge your production capabilities with an outstanding SUPH (Strips per Hour) capacity of up to 45,000. The C350 guarantees high-speed and uninterrupted die sorting, optimizing your overall manufacturing efficiency.
DIE SIZE: 0.2X0.4MM TO 8X8MM
Adapt to diverse semiconductor requirements with the C350's versatile die size compatibility. From ultra-compact 0.2x0.4mm dies to larger 8x8mm options, this system accommodates a broad spectrum of semiconductor components.
SWIR / NIR DIE CRACK INSPECTION
Ensure flawless components with advanced die crack inspection using Short-Wave Infrared (SWIR) and Near-Infrared (NIR) technologies. The C350 detects and addresses die cracks with unprecedented precision.
2ND TAPER, REEL TO REEL, MULTI-DIE, O/S TESTING
The C350 offers versatile sorting capabilities, including a 2nd taper option, Reel to Reel sorting, Multi-Die handling, and Open/Short Testing. This adaptability makes it a comprehensive solution for various semiconductor manufacturing scenarios.
REEL AUTO CHANGER (RAC)
Leverage automation for efficiency. The Reel Auto Changer (RAC) feature automates reel changes, minimizing manual interventions and optimizing the sorting process for enhanced efficiency.
