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DIE BONDERS > FC-1250
Machine Features
» SUPH up to 15,000
» Die size 0.3x8mm
» BH Force 0.5-10N
» Accuracy ±10µm
» Face-down; Dipping
FC-1250
CHIP TO SUBSTRATE/LEADFRAME
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
DIE BONDERS > FC-1210
Machine Features
» SUPH up to 5,500
» Die Size 0.5-6mm (6-20mm option)
» Bond Force Sensor
» Accuracy ±3µm local ±5µm global
» Face-up/Face-down; BH/Chunk Table Heating; Dipping
FC1210
Chip to Wafer
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