Products and Services > FlexiSort Series
explore FLEXISORT MODELS
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FS600
die transfer wafer to jedec tray
Pick head co planarity adjustment feature
3 Binning Trays
Additional Two (2) Manual Loading Binning Tray
Machine Features
» Die Transfer from Wafer to Jedec Tray
» SUPH up to 6,000
» Die Size 2x2mm to 21x21mm
» Binning Options Available
» Die Side Wall Inspection
» Flip and Non Flip
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
FlexiSort Series > FS500
FS500
die transfer wafer to jedec tray
Machine Features
» Component Transfer from Magazine to Jedec Tray
» SUPH up to 5,000
» Die Size 3x3mm to 10x10mm
» Die side Wall Inspection
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
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MIT Semiconductor Pte Ltd.
Your Partner in Innovation
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