FlexiSort 500

FlexiSort 500

The Flexisort FS500, an advanced Die Transfer to JEDEC Tray system designed for precision, speed, and adaptability in semiconductor manufacturing.The Flexisort Series FS500 represents a significant leap forward in die transfer technology. Seamlessly integrated into the FS500 are cutting-edge features that set a new standard for transferring semiconductor components to JEDEC trays.

Key Features

Die Transfer Carrier to Jedec Tray

The FS500 efficiently transfers semiconductor dies from the magazine to JEDEC trays, streamlining the production process.

SUPH up to 5,000

With impressive throughput capabilities, the FS500 ensures efficient handling of a large volume of dies, enhancing overall productivity.

Die Size: 2x2mm to 18x18mm

The FS500 accommodates die sizes ranging from 2x2mm to 18x18mm, providing flexibility for various semiconductor components.

Input and Output Vision

Integrated vision systems enable precise positioning and alignment during die transfer, ensuring accuracy and reliability.

2x Binning Tray

The FS500 features two binning trays, allowing for efficient sorting and organization of dies based on specific criteria.

Option: 4S Inspection

For enhanced quality control, the FS500 offers the option of 4S inspection, addressing potential defects with meticulous precision.
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