Flexisort FS600

Key Features

DIE TRANSFER FROM WAFER TO JEDEC TRAY

The FS600 excels in transferring dies from the wafer to JEDEC trays with unparalleled precision, ensuring a smooth and efficient integration into the semiconductor manufacturing workflow.

SUPH UP TO 6,000

Supercharge your production capabilities with an impressive SUPH (Strips per Hour) capacity of up to 6,000. The FS600 ensures high-speed and uninterrupted die transfer, optimizing overall manufacturing efficiency.

DIE SIZE 2X2MM TO 21X21MM

Adapt to diverse semiconductor requirements with the FS600's versatile die size compatibility. From compact 2x2mm dies to larger 21x21mm options, this system accommodates a broad spectrum of semiconductor components.

BINNING OPTIONS AVAILABLE

Customize your sorting process with available binning options. The FS600 allows you to categorize and organize dies based on specific parameters, enhancing flexibility in semiconductor manufacturing.

DIE SIDE WALL INSPECTION

Ensure flawless integration with die side wall inspection capabilities. The FS600 meticulously inspects the side walls of dies, addressing potential defects and contributing to the overall quality and reliability of transferred components.

FLIP AND NON FLIP

Tailor the die transfer process to your specific needs. The FS600 offers both flip and non-flip options, providing flexibility in orientation for a diverse range of semiconductor components.

Flexisort FS600

Introducing the Flexisort Series FS600, a cutting-edge Die Transfer from Wafer to JEDEC Tray system engineered for precision, speed, and adaptability. Redefine your semiconductor manufacturing processes with features seamlessly integrated into the FS600, setting a new standard for efficient and versatile die transfer.

The FS600 offers both flip and non-flip options, providing flexibility in die orientation to meet the specific requirements of your semiconductor components.The Flexisort Series FS600 Die Transfer from Wafer to JEDEC Tray system is not just a tool; it's a leap forward in semiconductor die transfer technology. Embrace precision, efficiency, and adaptability with FS600 – where every transferred die signifies excellence in semiconductor manufacturing.