smartflex sf1002

The SmartFlex SF1002 is an advanced semiconductor machine designed for Jedec Tray to Jedec Tray processes. Its impressive features include handling various package types (such as BGA, GW, and QFN) with die sizes ranging from 3 mm x 3 mm to 50 mm x 50 mm. The SF1002 seamlessly integrates cutting-edge features like high-resolution imaging technology, customizable inspection parameters, and fast reject sorting. Additionally, it offers stackable reject capabilities and conducts thorough 3D side wall inspections, ensuring comprehensive quality assessment during the packaging process. In summary, the SmartFlex SF1002 represents a leap forward in semiconductor packaging technology, combining speed, accuracy, and robust features.

Key Features

Tray to Tray Inspection

The SF1002 ensures thorough inspection and alignment when transferring components between Jedec trays, minimizing errors and enhancing quality control.

SUPH (Units per Hour) up to 70,000

With a remarkable throughput rate, the SF1002 accelerates production lines, meeting high-volume demands efficiently.

Component Compatibility

It handles various package types, including BGA, GW, and QFN, with die sizes ranging from 3 mm x 3 mm to 50 mm x 50 mm.

5S Vision

The SF1002 incorporates advanced vision systems for precise positioning and defect detection, maintaining product integrity.

Fast Reject Sorting

Rapid rejection of faulty components ensures optimal yield and reduces downstream processing time.

Stackable Reject and 3D Side Wall Inspection

The SF1002 offers stackable reject capabilities, streamlining handling. Additionally, its 3D side wall inspection ensures comprehensive quality assessment.