wtr804

The WTR804 is an advanced semiconductor machine that seamlessly performs Wafer to Tape & Reel (Non-Flip) processes. Its standout features include handling up to four reels simultaneously with multi-bin selection, achieving an impressive throughput of up to 18,000 units per hour (SUPH), accommodating die sizes ranging from 0.2 mm x 0.4 mm to 8 mm x 8 mm, conducting thorough 6S inspection of side walls, and ensuring rapid conversion in under 30 minutes.

Key Features

Wafer to Tape & Reel (Non-Flip)

The WTR804 seamlessly transfers wafers to tape and reel without flipping, ensuring precise alignment and minimizing handling errors.

4 Reel Output (Multi Bin Selection)

With the capability to handle up to four reels simultaneously, the WTR804 optimizes throughput. Its multi-bin selection feature allows for flexible organization of components during the packaging process.

SUPH (Units per Hour) up to 18,000

The WTR804 boasts an impressive throughput rate, achieving up to 18,000 units per hour. This high-speed operation streamlines production lines and reduces cycle times.

Die Size Compatibility

The machine accommodates a wide range of die sizes, from tiny 0.2 mm x 0.4 mm chips to larger 8 mm x 8 mm components. This versatility ensures compatibility with various semiconductor devices.

6S Inspection Side Wall

The WTR804 incorporates a robust inspection system that examines the side walls of each die. This quality control step helps identify defects, ensuring only flawless components proceed to the next stage.

Conversion Time < 30 Minutes

The WTR804 excels in rapid conversion between different wafer sizes and configurations. Its efficient setup and changeover process ensures minimal downtime, maximizing overall productivity.