MIT Semiconductor Pte Ltd.

Your Partner in Innovation

 

 

ABOUT US

 

 

PRODUCTS & SERVICES

 

 

contact us

explore CAERUS MODELS

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MIT Semiconductor Pte Ltd.

Your Partner in Innovation

 

 

ABOUT US

 

 

PRODUCTS & SERVICES

 

 

contact us

Specifications

 

» Wafer to Tape & Reel

» SUPH up to 45,000

» Die Size: 0.2x0.4mm to 8x8mm

» SWIR / NIR Die Crack Inspection

» 2nd Taper, Reel to Reel, Multi-Die

» Reel Auto Changer (RAC)

 

For more enquires, kindly contact:

 

    Tel:        +65 64810511

    Fax:      +65 64842519

 

MIT Semiconductor Pte Ltd.

Your Partner in Innovation

Specifications

 

» Wafer to Tape & Reel

» SUPH up to 40,000

» Die Size: 0.2x0.4mm to 8x8mm

» Die Crack Inspection

» Reel to Reel, Multi-Die, O/S Testing

» Reel Auto Changer (RAC)

 

For more enquires, kindly contact:

 

    Tel:        +65 64810511

    Fax:      +65 64842519

 

MIT Semiconductor Pte Ltd.

Your Partner in Innovation

Specifications

 

» Wafer to Tape & Reel

» SUPH up to 30,000 (Flip mode)

» Die Size: 0.2x0.4mm to 8x8mm

» Die Side Wall Inspection ≥10µm Defect Size

» Conversion < 30 mins

» Dynamic Drive Rotary with Short Setting Time

» NIR, Reel Auto Changer (RAC)

 

For more enquires, kindly contact:

 

    Tel:        +65 64810511

    Fax:      +65 64842519

 

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