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Caerus Series > C350
High Speed Die Sorter System - SINGLE TAPER RAC
Specifications
» Wafer to Tape & Reel
» SUPH up to 45,000
» Die Size: 0.2x0.4mm to 8x8mm
» SWIR / NIR Die Crack Inspection
» 2nd Taper, Reel to Reel, Multi-Die
» Reel Auto Changer (RAC)
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
Your Partner in Innovation
Caerus Series > C340
High Speed Die Sorter System - DUAL TAPER
High Speed Die Sorter System - RAC
Specifications
» Wafer to Tape & Reel
» SUPH up to 40,000
» Die Size: 0.2x0.4mm to 8x8mm
» Die Crack Inspection
» Reel to Reel, Multi-Die, O/S Testing
» Reel Auto Changer (RAC)
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
MIT Semiconductor Pte Ltd.
Your Partner in Innovation
Caerus Series > C330
High Speed Die Sorter System
- wafer to tape & reel
Specifications
» Wafer to Tape & Reel
» SUPH up to 30,000 (Flip mode)
» Die Size: 0.2x0.4mm to 8x8mm
» Die Side Wall Inspection ≥10µm Defect Size
» Conversion < 30 mins
» Dynamic Drive Rotary with Short Setting Time
» NIR, Reel Auto Changer (RAC)
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
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