» Jedec Tray to Jedec Tray

» SUPH up to 70,000

» BGA, GW, QFN 3x3mm to 50x50mm

» Auto Pitching

» Stackable Reject, 3D Side Wall Inspection

 

 

» Fly Over 2D/3D inspection

» Jedec Tray to Jedec Tray/Tape & Reel

» SUPH up to 18,000 (Tape)

» Fly Over Inspection for Leadless,       GW, BGA packages

» Ball Diameter up to 150µm

» Kit Less Conversion – Auto Pitching

» Advanced BPVI, OS Testing

 

 

 

 

» Post Sealing Inspection

» SUPH up to 80,000 for 2mm pitch

» Reel To Reel (Dual Track)

» Die & Package level up to 16mm tape size

» Dual Camera System