Products and Services > Optimus Series
explore OPTIMUS MODELS
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Optimus Series > MR3
Optimus Mr3
wafer to wafer
Machine Features
» Wafer to Wafer
» SUPH up to 15,000
» Die Size 0.5x0.5mm to 15x15mm
» Placement Accuracy +/- 30µm
» 6S Inspection
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
Machine Features
» Vision-aided die position correction ensures die placement accuracy
» Integrated vibration isolators on machine structure to enhance die
placement accuracy
» Wafer mapping capabilities include downloading of wafer maps
» Programmable die pickup force
» Reference die recognition via vision system
» Recipe management
For more enquires, kindly contact:
Email: sales@mit.com.sg
Tel: +65 64810511
Fax: +65 64842519
or click here
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